QY Research Says Advanced Semiconductor Packaging Market will Hit US$22488.34 Million Mark by 2026

Electronic devices are available several traditional kinds of package types for capacitors, magnets, semiconductors, and resistors. This has increased attention of the market towards the latest technology and constant innovations in packaging market. The global advanced semiconductor packaging market is valued at US$13632.74 mn in 2019 and is expected to reach US$22488.34 mn by the end of 2026, rising at a CAGR of 7.52 during 2020-2026.

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Higher performance and Low Power Consumption to Drive Market

The innovation in technology have led to the progress in semiconductor packaging technology  is driven by size reduction in electronic devices, its advantages over conventional packaging technologies, less power consumption, higher performance, lower thermal resistance, substrate-less package, and lower parasitic effects. As some of the semiconductor devices can be seamlessly connected to thin microns they enables maximizing interconnecting density and high bandwidth resulting in cost savings.

It eliminates the need for process flows including bumping, wafer fluxing, curing, flip-chip assembly, cleaning, and under fill dispensing. It is useful in various device that enables the use of including smartphones and computers. These factors are expected to boost the growth of FWLP to drive global advanced semiconductor packaging market.

Fan-out wafer-level packaging Segment Observe Highest Market Growth

Fan-out wafer-level packaging (FOWLP) will observe highest market growth as it provides a smaller package footprint which help manufacturers to decrees the global carbon footprints. Additionally, it also enhances the thermal and electrical performance of the batteries. These factors are expected to fuel the market demand in the forecast years.

Asia-Pacific to Grow Robustly in Global Advanced Semiconductor Packaging Market

Asia-Pacific will report robust growth in the global advanced semiconductor packaging market owing to the demand for electronics from the growing population and presences of major manufacturing companies in the region. Furthermore, China’s largest semiconductor market will further stimulate the growth of advanced semiconductor packaging demand.

Manufacturers to Focus in Boosting their Revenue and Improve Market Position

Recently, Amkor Technology, Inc., announced a new technology that will enable us to pave way for 5G mmWave antenna-in-package (AiP) technology. The company’s new cutting-edge AiP technology has been deployed into modules designed mobile devices. The company was first OSAT to market with 5G mmWave AiP technology and expanding its years of experience in advanced System in Package (SiP) experience. This strategy will boost the company’s output and improve its market position.

The major manufacturers covered in the report includes Powertech Technology Inc., TFM, SMC, Huatian, Amkor, Kyocera, Chipbond, Chipmos, UTAC, Nepes, Walton Advanced Engineering,  SPIL, Intel Corp, JCET, ASE, and others.

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Major Points From TOC:Advanced Semiconductor Packaging Market Overview
Market Competition By Manufacturers
Production By Region
Advanced Semiconductor Packaging Consumption By Region
Production, Revenue, Price Trend By Type
Consumption Analysis By Application
Company Profiles And Key Figures In Advanced Semiconductor Packaging Business
Advanced Semiconductor Packaging Manufacturing Cost Analysis
Market Dynamics
Consumption And Demand Forecast
Forecast By Type And By Application (2020-2026)

About QY Research

QY Research is a leading global market research and consulting company. Established in 2007 in Beijing, China, QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and custom research to help our clients in providing non-linear revenue models and make them successful. We are globally recognized for our expansive portfolio of services.